Ceramic PCB - 6L hdi printed circuit boards

HDI printed circuit boards(High Density Interconnect printed circuit boards) is a high wire distribution density PCB using micro blind vias. HDI PCBs have both internal and external circuits, and then use drilling and in-via metallisation to achieve internal connections between the circuit layers.

HDI printed circuit boards are usually manufactured using the lamination method. The higher the number of laminations, the higher the technical grade of the board. Common HDI PCBs are basically one-time laminations, while high-end HDI uses two or more layers. Advanced PCB technologies such as stacked vias, plated vias, and laser direct drilling are also used.

When the PCB density is increased to more than eight layers, the cost of HDI manufacturing will be lower than that of traditional complex pressing processes. HDI printed circuit boards benefit from advanced construction techniques, and their electrical performance and signal accuracy are higher than that of conventional PCBs; in addition, HDI printed circuit boards have better improvements in radio frequency interference, electromagnetic wave interference, electrostatic discharge and thermal conduction.

Electronic products continue to develop towards high-density, high-precision.The so-called ‘high’ means not only improve the performance of the machine, but also reduce the size of the machine. High Density Integration (HDI) technology allows for smaller end-product designs while meeting higher standards of electronic performance and efficiency. Currently, many popular electronic products, such as mobile phones, digital cameras, notebook computers, automotive electronics, etc., are using HDI printed circuit boards.With the upgrading of electronic products and market demand,the development of HDI printed circuit boards will be very rapid.