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There are many PCB printed circuit board industry standards, and it is impossible to remember them all, but I still hope everyone can know and understand some commonly used industry standards.
1. IPC-ESD-2020
Joint standard for the development of electrostatic discharge control programs. Including the necessary design, establishment, implementation and maintenance of electrostatic discharge control programs. Provides guidance for handling and protection of electrostatic discharges during sensitive periods based on the historical experience of certain military and commercial organizations.
2.IPC-SA-61A
Post welding cleaning manual. Covers all aspects of semi-aqueous cleaning, including chemicals, production residues, equipment, processes, process controls, and environmental and safety considerations.
3. IPC-AC-62A
Post welding cleaning manual.Describe manufacturing residues,the type and nature of aqueous cleaning agents, aqueous cleaning processes, equipment and techniques, quality control, environmental control and employee safety, and the cost of determination and determination of cleanliness.
4. IPC-DRM-40E
Through-Hole Solder Joint Evaluation Desk Reference Manual.Detailed descriptions of components, hole walls and welding surface coverage in accordance with standard requirements, in addition to computer-generated 3D graphics.Covers tin filling,contact angle,tin dipping,vertical filling, pad coverage and numerous solder joint defects.
5.IPC-TA-722
Welding Technology Assessment Manual.Includes 45 articles on various aspects of welding technology, covering general welding, welding materials, manual welding, batch welding, wave soldering, reflow soldering, vapor phase welding and infrared welding.
6. IPC-7525
Template design guide. Provides guidelines for the design and manufacture of solder paste and surface mount adhesive application templates. This guide also discusses template designs using surface mount technology and introduces hybrid technologies with through-hole or flip-chip devices, including overprint, double-print, and staged template designs.
7.IPC/EIAJ-STD-004
Specification requirements for flux include Appendix I.Contains the technical indicators and classification of rosin, resin, etc., organic and inorganic fluxes classified according to the halide content and activation degree in the flux also includes the use of flux,substances containing flux,and low-temperature fluxes used in no-clean processes. Residues of flux.
8. IPC/EIAJ-STD-005
The specification requirements for solder paste include Appendix I.Lists the characteristics and technical specifications of solder paste,including test methods and metal content standards, as well as viscosity, slump, solder balling,viscosity and solder paste dipping performance.
9. IPC/EIAJ-STD-006A
Specification requirements for electronic grade solder alloys, fluxed and non-fluxed solid solders.It provides electronic grade solder alloys,rod, ribbon, powdered flux and non-flux solders, applications of electronic solders, and provides terminology, specification requirements and test methods for special electronic grade solders.
10. IPC-Ca-821
General requirements for thermally conductive adhesives. Includes requirements and test methods for thermally conductive dielectrics that bond components in place.
11.IPC-3406
Guidelines for applying adhesives to conductive surfaces. Provides guidance on the selection of conductive adhesives as alternatives to soldering in electronics manufacturing.
12.IPC-AJ-820
Assembly and welding manual. Contains a description of inspection techniques for assembly and soldering, including terms and definitions; Specification references and outlines of printed circuit boards, component and pin types, solder joint information, component mounting, and design.Soldering techniques and packaging; Cleaning and lamination; quality assurance and testing.
13. IPC-7530
A guide to temperature profiling for batch soldering processes (reflow and wave soldering). Various testing methods, technologies and methods are used in obtaining temperature curves to provide guidance for establishing the best graphics.
14.IPC-TR-460A
Printed Circuit Board Wave Soldering Troubleshooting Checklist. A list of recommended corrective actions for failures that may be caused by wave soldering.
15. IPC/EIA/JEDECJ-STD-003A
Solderability testing of printed circuit boards.
16. J-STD-013
ball grid array (SGA) and other high-density technology applications. Establishes the specification requirements and interactions required for the printed circuit board packaging process to provide information for high-performance and high-pin-count integrated circuit package interconnections, including information on design principles,material selection, board manufacturing and assembly technologies, test methods, and Reliability expectations based on end use environment.
17.IPC-7095
Supplementary design and assembly process for SGA devices. Provides a variety of useful operating information for people who are using SGA devices or considering switching to array packaging; provides guidance on SGA inspection and repair and provides reliable information about the SGA field.
18.IPC-M-I08
Cleaning Instructions Manual. Includes the latest version of IPC cleaning guidance to assist manufacturing engineers as they determine cleaning procedures and troubleshooting for their products.
19.IPC-CH-65-A
Cleaning Guidelines in Printed Circuit Board Assembly. Provides a reference for current and emerging cleaning methods in the electronics industry, including a description and discussion of various cleaning methods, explaining the relationship between various materials, processes, and contaminants in manufacturing and assembly operations.
20.IPC-SC-60A
Post welding solvent cleaning manual. The use of solvent cleaning technology in automated and manual welding is presented, and solvent properties, residues, and process control and environmental issues are discussed.
21. IPC-9201
Surface Insulation Resistance Handbook. Contains the terminology, theory, testing process and testing methods of surface insulation resistance (SIR), as well as temperature and humidity (TH) testing, failure modes and troubleshooting.
22. IPC-DRM-53
Introduction to the Electronics Assembly Desk Reference Manual. Diagrams and photos used to illustrate through-hole mounting and surface mount assembly technology.
IPC Standards for PCB Manufacturing
23.IPC-M-103
Surface mount assembly manual standard. This section includes all 21 IPC files related to surface mount.
24.IPC-M-I04
Printed circuit board assembly manual standard. Contains the 10 most widely used files about Printed Circuit Board Assembly.
25.IPC-CC-830B
Efficacy and Qualification of Electronic Insulating Compounds in Printed Circuit Board Assembly. Conformal coatings meet an industry standard for quality and qualifications.
26.IPC-S-816
Surface mount technology process guide and checklist. This troubleshooting guide lists all types of process issues encountered in surface mount assembly and their solutions, including bridging, solder leaks, misaligned component placement, and more.
27.IPC-CM-770D
Printed circuit board component installation guide. Provides effective guidance for the preparation of components for printed circuit board assembly and reviews relevant standards, influences and releases, including assembly technologies (manual and automated as well as surface mount and flip-chip assembly technologies) and Considerations for subsequent welding, cleaning and laminating processes.
28. IPC-7129
Calculation of failures per million opportunities (DPMO) and printed circuit board assembly manufacturing quotas. It provides a satisfactory method for calculating benchmark quotas for the calculation of defects and quality-related industrial sectors' agreed benchmark quotas for the number of failures per million opportunities.
29. IPC-9261
Printed circuit board assembly yield estimates and assembly-in-progress failures per million opportunities. Defines a reliable method for calculating the number of failures per million opportunities during printed circuit board assembly and is a measure for evaluating each stage of the assembly process.
30.IPC-D-279
A design guide for reliable surface mount technology printed circuit board assembly. Guidance on reliable manufacturing processes for surface mount technology and hybrid technology printed circuit boards, including design considerations.
31. IPC-2546
Combined requirements for conveying key points in printed circuit board assembly. Material movement systems such as actuators and buffers, manual placement, automated screen printing, automated adhesive dispensing, automated surface mount placement, automated plated through hole placement, forced convection, infrared reflow ovens, and wave soldering are described.
32.IPC-PE-740A
Troubleshooting in printed circuit board manufacturing and assembly. Includes case records and correction activities for problems that arise during the design, manufacturing, assembly and testing of printed circuit products.
33. IPC-6010
Printed circuit board quality standards and performance specifications series of manuals. Includes quality standards and performance specifications set by the American Printed Circuit Board Association for all printed circuit boards.
34.IPC-6018A
Inspection and testing of finished microwave printed circuit boards. Includes performance and qualification requirements for high frequency (microwave) printed circuit boards.
35.IPC-D-317A
Adopt high-speed technology electronic packaging design guidelines. Provides guidance on the design of high-speed circuits, including mechanical and electrical considerations and performance testing.