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Ceramic PCB

Ceramic PCB

Ceramic PCB

Ceramic PCB

AIN PCB Substrate

AIN PCB Substrate

Substrate type: Aluminum Nitride Ceramic

Substrate thickness: 0.3-2.0mm

Conductive layer: copper, nickel, gold

Metal layer thickness: 35-400μm

Surface treatment: Nickel gold

Metal: 1L

Conductive hole: 0.2mm conductive hole

Line width: 0.1mm

Application: High-power LED

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AuSn heat sink substrate

AuSn heat sink substrate

Product Name: AuSn Heat Sink Substrate

Layers: 2

Thickness: 0.25mm

Copper thickness: 18-35um

Composition of solder layer: Au70Sn30, Au75Sn25

Solder layer thickness: 2-10 m ± 20%

Substrate materials: aluminum nitride, aluminum oxide, tungsten copper, molybdenum copper, quartz, silicon

Metalization layer: Ti/Pt/Au, Ti/Ni/Au,Cu/Ni/Au, Cu/Ni/Pd/Au

Customized metalization layer according to customer requirements

Application: High power chip, high-power laser

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Ceramic circuit board

Ceramic circuit board

Substrate type: 96% alumina ceramic

Substrate thickness: 0.3-2.0mm

Conductive layer: copper, nickel, gold

Metal layer thickness: 65 μ m

Surface treatment: Nickel gold

Metal : double-sided

Conductive hole: 0.2mm conductive hole

Line width: 0.05mm

Application: High power LED bead

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DPC Ceramic PCB

DPC Ceramic PCB

Substrate type: alumina ceramic

Substrate thickness: 0.5mm

Conductive layer: copper, nickel, gold

Metal layer thickness: 35μm

Surface treatment: ENIG

Metal: 1layer

Conductive hole: 0.3mm conductive hole

Line width: 0.1mm

Production process: DPC Ceramic

Application: LED Light

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Ceramic Aluminum Oxide PCB

Ceramic Aluminum Oxide PCB

Substrate type: 99% Al2O3

Substrate thickness: 1.6mm

Conductive layer: copper, nickel, gold

Metal layer thickness: 70μm

Surface treatment: Nickel gold

Metal : 1Layer

Conductive hole: 0.5mm

Line width: 0.25mm

Application: High power component

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SiC PCB

SiC PCB

Substrate type: Silicon Carbide(SiC)

Substrate thickness: 0.1-2.0mm

Conductive layer: Copper, nickel, gold

Metal layer thickness: 35-400μm

Surface treatment: Gold

Metal: 1L

Line width: 0.25mm

Application: laser

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Zirconia PCB

Zirconia PCB

Product: Zirconia PCB

Style: Zirconia ceramic

Materials: Zirconia

Brand: Support customer customization

MAX temperature: 750 degree

Precision rating: P5

Stock: Available

Density: 6.05 g/cm3

Place of origin: China

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Sapphire Circuit Board

Sapphire Circuit Board

Substrate type: Sapphire

Substrate thickness: 0.5mm

Conductive layer: copper, nickel, gold

Metal layer thickness: 35μm

Surface treatment: Gold

Metal: 1L

Line width: 0.15mm

Application: Laser emitter

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AMB Ceramic PCB

AMB Ceramic PCB

Substrate type: AIN Ceramic

Substrate thickness: 0.3-3.0mm

Conductive layer: copper, nickel, gold

Metal layer thickness: 35-400μm

Surface treatment: Nickel gold

Metal: 1L

Conductive hole: 0.2mm conductive hole

Line width: 0.1mm

Application: High power component

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DBC Ceramic PCB

DBC Ceramic PCB

Substrate thickness: 1.0mm

Layers: 1L

Substrate: 96% alumina ceramic base

Thermal conductivity: 30W

Surface technology: ENIG

Copper thickness: 300um

Manufacturing process: DBC Ceramic

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LTCC (Low Temperature Co-fired Ceramic)

LTCC (Low Temperature Co-fired Ceramic)

Product: LTCC (Low Temperature Co-fired Ceramic)

Dimensions：120 mm × 120 mm

Minimum line width/line spacing: min.0.075mm/0.15mm

Aperture: min.0.1mm

Accuracy: ±0.2%

Layer: ≤4 layers

Product application: LTCC module

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