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G1360 “GB/T1360-1998 printed circuit grid system”.
G4588.1 “GB/T4588.1-1996 non-metallized holes single and double-sided printed circuit board sub-specification”.
G4588.2 “GB/T4588.2-1996 single and double-sided printed circuit board with metalized holes sub-specification”.
G4588.3 “GB/T4588.3-2002 printed circuit board design and use”.
G4677 《GB/T4677-2002 Printed Circuit Board Test Methods》.
G4724 “GB/T 4724-1992 Copper Foil Epoxy Paper Laminates for Printed Circuits”.
G4725 “GB/T 4725-1992 Copper Foil Epoxy Glass Cloth Laminates for Printed Circuits”.
G5130 “GB/T5130-1997 Test Methods for Thermosetting Resin Industrial Hard Laminates for Electrical Applications”.
G7911 《GB/T 7911-1999 High Pressure Decorative Laminates with Thermosetting Resin Impregnated Paper（HPL）》.
G10244 《GB10244-1988 Television Broadcast Receiver Printed Circuit Board Specification》.
G14515 《GB/T14515-1993Technical Conditions for Single- and Double-sided Flexible Printed Circuit Boards with Through-Connections》.
G14708 《GB/T 14708-1993 Flexible Printed Circuit with Adhesive Coated Polyester Film》.
G14709 “GB/T 14709-1993 Adhesive Coated Polyimide Films for Flexible Printed Circuits”.
G15157.2 “GB/T15157.2-1998 Two-piece Connectors for Printed Circuit Boards with Basic Grid of 2.54mm (0.1in)”.
G15157.7 《GB/T15157.7-2002 Detailed Specification for 8-bit Specific and Free Connectors with Universal Insertion and Closure Characteristics with Quality Assessment》(G15157.7-2002)
G15157.12 《GB/T 15157.12-2011 Frequency lower than 3MHz printed circuit board connector: integrated circuit socket dimensions, general requirements and test methods detailed specification》.
G15157.14 《GB/T 15157.14-2007 Audio, video and audio-visual equipment with bass and video circular connector detailed specification》.
G16261 《GB/T16261-1996 General Specification for Printed Circuit Board》.
G16315 “GB/T16315-1996 printed circuit with limited flammability of copper-clad glass cloth laminate”.
G16317 《GB/T16317-1996 Multi-layer Printed Circuits with Flammability-limited Thin Copper Foil Glass Cloth Laminates》(G16317-1996Multi-layer Printed Circuits with Thin Copper Foil Glass Cloth Laminates)
G17562.1 “GB/T17562.1-1998 Rectangular connectors with frequency less than 3MHz: Connectors with quality assessment requirements”.
G17562.8 《GB/T17562.8-2002 Detailed specification for connectors with 4 signal contacts and ground contact for cable shielding》.
G18334 “GB/T18334-2001 flexible multi-layer printed circuit board with through connection specification”.
G18335 “GB/T18335-2001 through the connection of rigid multi-layer printed circuit board specification”.
G18373 《GB/T 18373-2013 Printed Circuit Board with E Glass Fiber Cloth》.
G19247.1 《GB/T19247.1-2003 Printed Circuit Board Assembly: General Specification for the Adoption of Surface Mounting and Related Assembly Techniques for Electronic and Electrical Soldering and Assembly Requirements》.
G19247.2 《GB/T19247.2-2003 Printed Circuit Board Assembly: Sub-standardization of surface mounting welding assembly requirements》.
G19247.3 “GB/T19247.3-2003 Printed Circuit Board Assemblies: Requirements for Through-Hole Mounting and Soldering Assemblies”.
G19247.4 “GB/T19247.4-2003 Printed Circuit Board Assembly: Requirements for Lead-in Breakout Soldering Assembly”.
G29846 《GB/T 29846-2013 Printed Circuit Boards with Photoimageable Electroplating Resistant Anti-corrosion Agent》.
G29847 Test Methods for Copper Foil for Printed Circuit Boards GB/T 29847-2013
G31988 《GB/T 31988-2015 Aluminum-based Copper Clad Laminates for Printed Circuits》.
GJZ163 《GJB/Z 163-2012 Z Technical Guide for Soldering of Printed Circuit Components》.
GJ362B 《GJB362B-2009 Z General Specification for Rigid Printed Circuit Boards》(GJB362B-2009 Z General Specification for Rigid Printed Circuit Boards)
GJ1438Z “GJB1438A-2006 Z General Specification for Printed Circuit Connectors and their Accessories”.
GJ1438/3 “GJB 1438/3-2002 CY1 series of reed hole printed circuit connector detailed specification”.
GJ1438/4 “GJB 1438/4-2002 CY23 series of reed hole printed circuit connector detailed specification”.
GJ1438/5 “GJB 1438/5-2002 J18 series of wire reed hole printed circuit connector detailed specification”.
GJ1651 《GJB1651-1993 Printed Circuit Metal Foil Laminate Test Method》.
GJ1717 “GJB1717-1993 general printed circuit board electrical connector general specification”.
GJ2830 《GJB2830-1997 Design Requirements for Flexible and Rigid Printed Circuit Boards》.
GJ3835 《GJB3835-1999 General Requirements for Surface Mounted Printed Circuit Board Assemblies》.
GJ5807 《GJB5807-2006 Z Military Printed Circuit Board Assemblies Post-soldering Cleaning Requirements
QJ201B 《QJ 201B-2012 Specification for Rigid Single- and Double-sided Printed Circuit Boards for Aerospace Applications》.
QJ1462A “QJ1462A-1999 Technical Conditions for Acid Bright Copper Plating Layer on Printed Circuit Board”.
QJ2598A “QJ 2598A-2012 Printed Circuit Board Quality Control Procedures and Requirements”.
QJ2776 “QJ2776-1995 Requirements and Methods for Printed Circuit Board Pass-Through Test”.
QJ2860 《QJ 2860-1996 Technical Requirements for Printed Circuit Board Hole Metal Processing》.
QJ3015 “QJ3015-1998 Technical Requirements for Printed Circuit Board Graphic Transfer Process”.
QJ3086 “QJ 3086-1999 High Reliability Soldering of Surface and Mixed Mount Printed Circuit Board Assemblies”.
QJ3103A “QJ3103A-2011 Design Requirements for Printed Circuit Boards”.
QJ3113 《QJ3113-1999 Rules and Methods for Verification of Adhesive Sheets for Multilayer Printed Circuit Boards》.
QJ20023 “QJ20023-2011 Design Requirements for Highly Reliable Surface Mounted Printed Circuit Board Assemblies”.
QJ20172 “QJ 20172-2012 Technical Requirements for Electroplating Pure Tin on Printed Circuit Boards”.
SJ10500 《SJ/T 10500-1994 CH1 Type Printed Circuit Connectors》.
SJ10501 《SJ/T 10501-1994 CY3 Type Printed Circuit Socket Connectors》.
SJ10715 “SJ/T10715-1996 non-metallized holes single and double-sided printed circuit board capacity detailed specification”.
SJ10716 “SJ/T10716-1996 have metalized holes single and double-sided printed circuit board capacity detailed specification”.
SJ10717 “SJ/T10717-1996 multi-layer printed circuit board capacity detailed specification.
SJ10723 “SJ/T10723-1996 printed circuit auxiliary documents photographic plate guide”.
SJ11171 “SJ/T11171-1998 non-metallized hole single and double-sided carbon film printed circuit board specification”.
SJ11282 “SJ/T11282-2003 printed circuit board with” E “fiberglass paper specification”.
SJ11283 “SJ/T11283-2003 printed board with the treatment of” E “glass fiber cloth specification”.
SJ20439 “SJ20439-1994 printed circuit board assembly design requirements”.
SJ20604 “SJ20604-1996 flexible and rigid flexible printed circuit board specification”.
SJ20748 《SJ20748-1999 Rigid Printed Circuit Board and Rigid Printed Circuit Board Assembly Design Standards》.
SJ20766 “SJ20766-1999 panel type and printed circuit type test socket general specification”.
SJ20776 《SJ20776-2000 Printed circuit board layout data format Gerber》.
SJ20810 “SJ20810-2002 printed circuit board dimensions and tolerances”.
SJ20958 《SJ 20958-2006 Bare Substrate Electrical Test Data Format》.
SJ20959 《SJ 20959-2006 Digital Format Description of Printed Circuit Boards》(SJ20959-2006 Printed Circuit Boards)
J7489 《JB/T 7489-1994 Instrument and Meter Printed Circuit Board Assemblies Repair and Welding Craft Specification》
HJ450 “HJ 450-2008 Clean Production Standard for Printed Circuit Board Manufacturing Industry”.
