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RF Circuit Board

RF Circuit Board - CT350 RF PCB

RF Circuit Board

RF Circuit Board - CT350 RF PCB

  • CT350 RF PCB
    CT350 RF PCB

    Product: CT350 RF PCB

    Material: Hydrocarbons+Ceramics

    Layer: 2layer and multilayer

    Dielectric constant: 3.0-6.15

    Medium thickness: 4mil-60mil

    Base copper thickness: 0.5oz

    Outer copper thickness: 1oz

    PCB thickness: 0.2mm-6.0mm

    Solder mask colors: green, red, blue

    Surface treatment: ENIG

    Application: microwave communication

    Product Description Technical Datasheet

    The WL series microwave PCB material is manufactured using a mixture of hydrocarbons and ceramics, with a white substrate material.


    Model: WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615

    Dielectric constant (Dk) 3.0-6.15


    WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615 Datasheet
    Product
    iPCB.com
    Dk
        (εr) @10G
    Df
     (tgδ)@10G
    TcDk
    ppm/ºC

    Density

    (g/cm3)

    Peel strength

    (1OZ)N/mm

    Thermal expansion coefficient
     ppm/ºC
    XYZ
    WL-CT3003.00±0.052.980.0030271.570.850.72151431
    WL-CT3303.30±0.063.450.0026431.821.00.72151339
    WL-CT330Z3.30±0.063.450.0030431.780.850.72161339
    WL-CT3383.38±0.053.550.0029451.781.00.72141650
    WL-CT3503.48±0.053.660.0039521.900.850.72111434
    WL-CT4404.10±0.084.380.0050-212.001.0/141835
    WL-CT6156.15±0.156.400.0040-1222.180.9/151733


    Product: CT350 RF PCB

    Material: Hydrocarbons+Ceramics

    Layer: 2layer and multilayer

    Dielectric constant: 3.0-6.15

    Medium thickness: 4mil-60mil

    Base copper thickness: 0.5oz

    Outer copper thickness: 1oz

    PCB thickness: 0.2mm-6.0mm

    Solder mask colors: green, red, blue

    Surface treatment: ENIG

    Application: microwave communication


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