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RF Circuit Board

RF Circuit Board - High-frequency Circuit Board

RF Circuit Board

RF Circuit Board - High-frequency Circuit Board

  • High-frequency Circuit Board
  • High-frequency Circuit Board
    High-frequency Circuit Board

    Product: High-frequency PCB

    Material: Rogers, Taconic

    Layer: 2layers

    Dk: 2.2, 2.55, 2.65, 3.0, 3.38, 3.48, 6.2, 10.2

    Medium thickness: 5mil-62mil

    Base copper thickness: 0.5oz, 1oz

    Outer copper thickness: 1oz, 2oz

    Solder mask colors: green, red, blue

    Surface treatment: Immersion silver, Gold

    Application: RF communication

    Product Description Technical Datasheet

    High frequency circuit board is specialized circuit board with high electromagnetic frequencies, generally defined as frequencies above 1GHz. Its various physical properties, accuracy, and technical parameters require very high standards, and it is commonly used in fields such as automotive collision prevention systems, satellite systems, and radio systems. The high frequency of electronic devices is a development trend, especially with the increasing development of wireless networks and satellite communications. Information products are moving towards high speed and high frequency, and communication products are moving towards standardized wireless transmission of voice, video, and data with large capacity and high speed. Therefore, the new generation of products requires high-frequency substrates, and communication products such as satellite systems and mobile phone receiving base stations must use high-frequency circuit board.


    Requirements for high-frequency circuit board

    1. Dielectric constant Dk It must be small and stable, usually the smaller the better. The transmission rate of the signal is inversely proportional to the square root of the dielectric constant of the material, and a high dielectric constant can easily cause signal transmission delay.

    2. Dielectric loss Df It must be small, which mainly affects the quality of signal transmission. The smaller the dielectric loss, the smaller the signal loss.

    3. Try to match the thermal expansion coefficient of copper foil as much as possible, as inconsistency can cause copper foil separation during cold and hot changes.

    4. Low or high water absorption will affect the dielectric constant and dielectric loss when exposed to moisture.

    5. Other properties such as heat resistance, chemical resistance, impact strength, and peel strength must also be good.


    Partial high-frequency circuit board material

    * Nelco N4000-12/N4000-12SI

    * Nelco N4000-13EP/N4000-13EPSI

    * Nelco N8000

    * Isola FR408, FR 408 HR

    * Isola IS 415

    * Hitachi LX-67Y, FX II

    * Getek

    * Panasonic Megtron +

    * Panasonic R2125

    * Panasonic Megtron VI


    Rogers high-frequency circuit board

    RO4003C, RO4350B, RO4360, RO4533, RO4535, RO4730, RO4232, RO4233, RO3003RO3006, RO3010, RO3035, RO3203, RO3206, RO3210, RO3730, RO5780, RO5880RO6002, RO3202, RO6006


    Taconic high-frequency circuit board

    TLY-5A, TLY-5, TLY-3, HT15, TLX-0, TLX-9, TLX-8, TLX-7, TLX-6, TLC-27, TLE-95TLC-30, TPG-30, TLG-30, RF-30, TSM-30, TLC-32, TPG32, TLG-32, TLG-34, TPG35TLG-35, RF-35, RF-35A, RF-35P, RF-41, RF-43,RF-45, RF-60A, CER-10


    Arlon high-frequency circuit board

    AD255 C03099, AD255 C06099, AD255C04099, AD300 CO3099, AD300 C04099AD300 C06009, TC600, AD250 C02055C, TC350, MCG300CG, DCL220, CUCLAD 217LXCUCLAD 250GX, ARLON 55NT


    Other high-frequency circuit board

    F4BK225, F4BK265, F4BK300, F4BK350, F4BM220, F4BM255, F4BM265, F4BM300, F4BM350



    Difficulties in Manufacturing High Frequency Circuit Board

    1. Copper deposition: The hole wall is not easily coated with copper

    2. Control of graphic transfer, etching, line width gaps, and sand holes

    3. Green oil process: green oil adhesion, green oil foaming control

    4. Strictly control surface scratches and other issues in each process.

    High-frequency Circuit Board

    High-frequency Circuit Board

    Product: High-frequency PCB

    Material: Rogers, Taconic

    Layer: 2layers

    Dk: 2.2, 2.55, 2.65, 3.0, 3.38, 3.48, 6.2, 10.2

    Medium thickness: 5mil-62mil

    Base copper thickness: 0.5oz, 1oz

    Outer copper thickness: 1oz, 2oz

    Solder mask colors: green, red, blue

    Surface treatment: Immersion silver, Gold

    Application: RF communication


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