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PCB circuit board is an important electronic component, is the support of electronic components, is the carrier of electronic components electrical connection.In the process of PCB manufacturing and processing, the need to go through the process of baking circuit boards, then the PCB baking and baking requirements and attention to what?
PCB baking requirements
1.Regularly check the material storage environment is within the scope of the regulations.
2.The staff must be trained.
3.PCB baking process, if any abnormalities, must be timely notification of the relevant scientific and technological personnel.
4.Contact with materials must be good anti-static and heat insulation measures.
5.Leaded and lead-free materials need to be stored and baked separately.
6.After the baking process is completed, the materials must be cooled down to room temperature before they can be placed on the line or packaged.
PCB circuit board
PCB baking pipeline
1.Large PCBs are mostly placed flat, up to 30 stacks, PCBs are taken out of the oven within 10 minutes after baking, and then placed flat at room temperature for natural cooling.
2.Small and medium-sized PCBs are mostly placed flat, up to 40 pieces stacked, the number of upright is not limited to the completion of the baking within 10 minutes from the oven to remove the PCB, at room temperature, flat natural cooling.
PCB baking notes
1.PCB circuit boards if the oven, must have a blower and constant temperature control, in order to make the pre-baking temperature uniform.And the oven should be clean and free of impurities, so as not to fall on the board and damage the film surface.
2.Do not use natural drying, and drying must be complete, otherwise it is easy to stick the negative and lead to poor exposure.
3.After pre-drying PCB circuit board processing, the multi-layer circuit board board should be air-cooled or naturally cooled before exposure of the negative alignment.
4.After pre-drying the multi-layer circuit boards, the coating to the development of shelving time of up to two days, humidity, as far as possible in half a day exposure development.
5.Different requirements for different models of liquid photoresist should be read carefully and the process parameters should be adjusted according to the production practice, such as thickness, temperature and temperature.Temperature.Time, etc.
6.It is important to control the temperature and time of pre-baking.If the temperature is too high or the time is too long, it will be difficult to develop the film and it will not be easy to remove the film.If the temperature is too low or the time is too short, the drying is not complete, the film is pressure-sensitive, easy to stick to the negative and lead to poor exposure, and easy to damage the negative.Therefore, multi-layer circuit board processing pre-drying is appropriate, faster development and de-filming, good graphic quality.
The above is the PCB manufacturer Aibi circuit for you to introduce the PCB circuit board baking requirements and attention to what the analysis, I hope to be able to give you a reference.