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The PCB design process errors consists of a series of industrial design steps, which is the key link to ensure the quality of large-scale circuit board products and reduce troubleshooting.
PCB is the basis of industrial electronic product design. Whether it is small-scale production or mass-produced consumer electronics, almost all design technologies include PCB design.
Due to the complexity of the design process, many common errors will occur repeatedly. The following lists the five most common design problems in PCB design and their corresponding countermeasures.
1. Pin Error-PCB design process errors
A series linear regulated power supply is cheaper than a switching power supply, but the power conversion efficiency is low. Usually, many engineers choose to use a linear regulated power supply in view of its ease of use and good quality and low price. However, it should be noted that although it is convenient to use, it consumes a lot of power and causes a lot of heat dissipation. In contrast, the switching power supply is complex in design but more efficient. However, it should be noted that the output pins of some regulated power supplies may be incompatible with each other, so before wiring, it is necessary to confirm the relevant pin definitions in the chip manual.
2. Wiring Error-PCB design process errors
The difference between design and wiring is the main error in the final stage of PCB design. Therefore, it is necessary to repeatedly check some things, such as device size, via quality, pad size and review level. In short, it is necessary to check repeatedly against the design schematic.
3. Corrosion traps-PCB design process errors
When the angle between PCB leads is too small (that is, it is acute), corrosion traps may be formed. These acute-angle connections may have residual corrosion liquid during the circuit board corrosion stage, thereby removing more copper from the area, forming a card point or trap. Later, it may cause the lead to break and form an open circuit. In modern manufacturing processes, this corrosion trap phenomenon has been greatly reduced due to the use of photosensitive corrosion solutions.
4. Tombstone devices-PCB design process errors
When using the reflow process to solder some small SMT devices, the device will form a single-end warping phenomenon under the infiltration of solder, commonly known as "tombstone". This phenomenon is usually caused by an asymmetric wiring pattern, which makes the heat diffusion on the device pad uneven. Using the correct DFM inspection can effectively alleviate the occurrence of the tombstone phenomenon.
5. Lead width-PCB design process errors
When the current of the PCB lead exceeds 500mA, the minimum wire diameter of the PCB will appear to be insufficient. Generally speaking, the surface conductors of a PCB carry more current than the internal conductors of a multi-layer PCB because the surface conductors can diffuse heat through the air. The line width is also related to the thickness of the copper foil of the layer. Most PCB manufacturers allow you to choose copper foils of different thicknesses from 0.5 oz/sq.ft to 2.5 oz/sq.ft.
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