sales@ipcb.com
Often encountered PCBA customers will ask, our solder paste management system is how, today I share with you Audemars Piguet Circuit solder paste management system is as follows.
1.Purpose:
To regulate the management process of purchasing, storing and using solder paste, which is the main consumable of SMT, to ensure the stability of the quality of the products.
2.Scope:
Applicable to the company's management of all processes related to solder paste.
3.Definition: Omitted.
4.Responsibilities
Purchasing Department: Responsible for the purchasing of solder paste.
Engineering Department: SMT process engineers are responsible for the formulation of relevant operational files and process technical support.
Manufacturing Department: Responsible for purchasing, storage, proper use and recycling management of solder paste.
Quality Assurance Department: Responsible for monitoring and controlling the management process.
5.Operation Process:
5.1 Purchase management: Purchasing Department receives the purchase request form from the warehouse PMC, and then looks for qualified suppliers to carry out the purchase of the corresponding models. In view of the short shelf life of the solder paste, the solder paste provided by the supplier is required to be within 30 days of the date of leaving the factory, specifically based on the date of production on the bottle of the solder paste, and the delivery needs to be refrigerated with a dry ice bag.
5.2 Warehouse Receiving Management:
5.2.1 The warehouse receives the goods to confirm whether the packaging is in line with the norms, whether there is dry ice in the box of solder paste and whether the temperature is significantly lower than room temperature.
5.2.2 Confirm whether the production date of the solder paste is within 30 days of the date of receipt, whether the production date of the red glue is within 90 days of the date of receipt, such as exceeding this time limit, the goods will be rejected; such as urgent use, you can apply for special procurement, but need to be analysed by the planning department based on the progress of the consumption of the normal use of the end of the month, and reported to the vice president for approval, and to carry out the right to special procurement of the inventory system.
5.2.3 After confirming the receipt of the goods, the material personnel will print out the solder paste management label and paste it on each solder paste bottle for the management of first-in-first-out, daily use and different models.
5.2.4 Management of solder paste numbering: Batch number: 01~99 for the same batch.
Brand model: XX for the same manufacturer different model code, the first model is 00, new 01 and so on;S for the different manufacturer code, YYYYMMDD factory date: such as 5 February 2014 for 20140205
5.3 solder paste storage management:
5.3.1 Storage temperature:lead-free and leaded solder paste storage conditions: temperature 2 ° C ~ 10 ° C, pay attention to moisture, sealed storage. Every working day, the warehouse manager will measure the temperature of the freezer area where the solder paste is placed and record it in the ‘Refrigerator Temperature Record Sheet’. If there is any abnormality, notify the chief immediately for emergency transfer.
5.3.2 Storage period:The original sealed storage period is 180 days from the date of shipment. Within 1 month after initial opening and use.
5.3.3 The solder paste manager will place the solder paste into the cooler neatly according to the number from big to small, and different batches will be clearly marked and stratified, and the solder paste returned from the production line will be placed in a specific area and used with priority.
5.4 Collection Management
5.4.1 The production department notifies the warehouse in advance to prepare for the use of solder paste according to the production plan, including the amount of solder paste, the model and brand of solder paste, and the time of use. The material personnel will take out the corresponding solder paste according to the requirements of the first-in-first-out requirements for the management of the use, and take out the solder paste to thaw according to the plan, so as not to lead to the exposure of ambient temperature for a long time and scrap or affect the use of the time limit.
5.4.2 All the solder paste used and returned by production must be registered, and different brands/models should be recorded on different pages, so as to clearly understand the implementation status of FIFO.
5.4.3 Removed solder paste should be placed in a cooler at room temperature for 4 hours before it is transferred to the production department, and should not be forced to be heated. When the solder paste is collected, it should be scanned and the information such as in/out time and use/return time should be recorded in the record book and on the label of the solder paste bottle.
5.5 Solder Paste Management
5.5.1 The production line will take out the warmed up solder paste from the warehouse, fill in the specific time in the ‘time of taking out’ column on the solder paste bottle, and use it after stirring for 2~3 minutes by the mixer. If it is not possible to stir by machine, it is necessary to stir manually. Stir manually for 3~5 minutes, and make sure the stirring is comprehensive to ensure that the middle, wall and bottom of the bottle can be fully stirred. The cap should not be loosened before mixing.
5.5.2 Stirring time: 2-4 minutes. Stirring direction: clockwise; stirring speed: 100RPM.
5.5.3 The remaining solder paste in the container after opening should be fastened with the cap immediately, and if it is used continuously, it should be placed in the workshop, and new solder paste can be obtained only when it is used up. The printer should add more solder paste according to the amount of product consumed, about 1/4 bottle at a time.
5.5.4 If the warming time exceeds 24 hours, and if the product is not used up within 24 hours after 4 hours of warming in the production line, it should be returned to the freezer for storage in a timely manner. After 4 hours in the freezer, the product can be thawed and used first.
5.5.5 After 4 hours of normal rewarming, solder paste will be counted as ambient exposure time. The cumulative ambient exposure time for each bottle of solder paste is 48 hours, after 48 hours, it will be scrapped.
5.5.6 Each bottle of solder paste is only allowed to be defrosted out of the cabinet twice, and if it is defrosted more than twice, it will be discarded. The counting point of defrosting is 4 hours after the scanning.
5.5.7 If the production line is stopped for more than 4 hours, the solder paste on the stencil should be recycled separately, not mixed with the unused solder paste in the bottles, and put into the freezer for storage.
5.5.8 PCBs printed on the production line must be laminated within 1 hour, and the reflow oven must be completed within 2 hours after the laminated PCBs are laminated, and the first product can be extended for 1 hour due to the time taken for checking. The first product can be extended for 1 hour due to the time taken for verification. The product that has not completed the next process after the time limit should be cleaned and baked before re-producing the PCB.
5.5.9 After the solder paste is scrapped, it should be recorded in the ‘solder paste scrap record sheet’, which can be verified by the process engineer whether it can be used for other purposes (e.g., used in high current circuit to increase the flow of tin or 0805 or above the device of the general consumer products) or discarded for disposal.
6.Relevant forms and files:
Record sheet of tin paste scrapping.
Refrigerator Temperature Record Meter
Tin paste management flow chart