RF Circuit Board - Rogers 6035HTC PCB

RT/duroid 6035HTC high-frequency board material is the best choice for high power. The thermal conductivity of RT6035 is about 2.4 times that of standard RT/duroid 6000 products, and the copper foil (ED and reverse treatment) has excellent long-term thermal stability. In addition, Rogers' advanced packing system gives the product excellent drilling processing characteristics, which reduces drilling costs compared to standard high thermal conductivity laminates using alumina packing.

Features of RT6035 HTC

Dk=3.50

Df=0.0013

Thermal conductivity 1.44 W/m/K

Low roughness and reverse processing of copper foil result in excellent thermal stability

High thermal conductivity

The increase in thermal conductivity of the medium can lower the operating temperature, making it suitable for high-power applications

Has excellent high-frequency performance

Low insertion loss and excellent thermal stability of the circuit

Rogers 6035HTC Datasheet

The heat source in high-power RF amplifiers is mainly the heat generated by device efficiency loss and transmission loss.

The main ways to dissipate the heat generated by device efficiency loss are: selecting RF circuit boards with high thermal conductivity; Device pad through-hole heat transfer; Add a heat sink on the surface of the device; Directly assemble the device onto a metal block or box.

However, the heat dissipation method for transmission loss is relatively limited. In this regard, the design consideration is mainly to reduce transmission loss and choose RF circuit boards with high thermal conductivity. Therefore, in the design process, it is important to focus on the dissipation factor and thermal conductivity of the sheet metal.

Whether it is radar communication in aviation or cellular base stations in mobile communication, more stringent requirements are placed on the performance of high-power amplifiers. RT/duroid 6035HTC meets the requirements of high-power amplifiers for board materials, helping high-power amplifiers achieve higher performance.