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RF Circuit Board

RF Circuit Board - Rogers CuClad PCB

RF Circuit Board

RF Circuit Board - Rogers CuClad PCB

  • Rogers CuClad PCB
    Rogers CuClad PCB

    Product: Rogers CuClad PCB

    Material: Cuclad Series

    Layer: Double-sided and multi-layer

    CuClad Dk: 2.17 - 2.5

    CuClad Df: 0.0009 - 0.0025

    CuClad base copper thickness: 0.5oz

    Outer copper thickness: 1oz

    Solder mask colors: green, red, blue

    Surface treatment: silver, gold, osp

    Application: Radar, satellite, instrument

    Product Description Technical Datasheet

    Rogers CuClad high-frequency PCB material is a composite material made of glass fiber cloth and PTFE, which can be used as PCB substrate and antenna cover in high-frequency circuit applications. The dielectric constant (Dk) of CuClad high-frequency PCB material ranges from 2.17 to 2.60. CuClad PCB has the characteristics of low dielectric loss, X-band loss tangent value between 0.0009 and 0.0018, and low moisture absorption rate. Rogers CuClad high-frequency PCB material can provide a maximum size of 36 "x 48".


    Rogers CuClad high-frequency PCB includes CuClad 217, CuClad 233, CuClad 250, CuClad 6250, CuClad 6700


    CuClad 217

    Dk=2.17 or 2.20

    Df =0.0009

    Using a lower glass fiber/PTFE ratio to achieve the lowest dielectric constant and loss factor among similar products.

    Low moisture absorption and low gas release rate

    Stable dielectric constant with frequency variation


    CuClad 233

    Dk = 2.33

    Df = 0.0013

    By using a moderate ratio of fiberglass to PTFE, a balance can be achieved between reducing the dielectric constant and improving the loss factor, without affecting the mechanical properties.

    CuClad 233 uses a staggered woven fabric structure for better dimensional stability while balancing electrical and mechanical properties.


    CuClad 250

    Dk = 2.40 - 2.60

    Df = 0.0018

    Using a higher ratio of fiberglass to PTFE can provide mechanical properties similar to traditional substrates.

    CuClad 250 provides better dimensional stability and lower thermal expansion characteristics in all directions.


    CuClad 6250

    Dk = 2.32

    Df =  0.0015

    Thickness of 0.0015 "(. 038mm)

    CuClad 6250 is an ethylene acrylic thermoplastic copolymer that can be used for low-temperature and low-pressure bonding of PTFE/glass materials. CuClad 6250 offers 24 "(610 mm) roll or sheet sizes.


    CuClad 6700

    Dk =2.35

    Df = 0.0025

    Thickness of 0.0015 "(0.038 mm) and 0.003" (. 076 mm)

    CuClad 6700 is a thermoplastic copolymer of trichlorofluoroethylene (CTFE). Recommended for bonding PTFE (polytetrafluoroethylene) substrates in microwave ribbon line structures and other multilayer board circuits. It can also be used for bonding other structural and electrical components. CuClad 6700 is available in 24 "(610 mm) roll and sheet sizes.

    Rogers CuClad SheetData

    Rogers CuClad SheetData

    CuClad Series - CuClad 217, CuClad 233, CuClad 250 are very unique high-frequency circuit boards. The cross layered structure makes the electrical and mechanical properties isotropic in the plane, achieving a good balance between electrical and mechanical properties. CuClad 217, CuClad 233, CuClad 250 use glass woven fabric with strictly controlled PTFE content to provide low dielectric constant values, resulting in wider wires and effectively reducing insertion loss. Suitable for aviation, satellite equipment and other equipment that require strict requirements (CuClad 233's planar CTE matches aluminum used in aircraft surfaces and structures).

    Product: Rogers CuClad PCB

    Material: Cuclad Series

    Layer: Double-sided and multi-layer

    CuClad Dk: 2.17 - 2.5

    CuClad Df: 0.0009 - 0.0025

    CuClad base copper thickness: 0.5oz

    Outer copper thickness: 1oz

    Solder mask colors: green, red, blue

    Surface treatment: silver, gold, osp

    Application: Radar, satellite, instrument


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