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In the production process of PCBA processing,it is difficult to avoid the problem of the discarding of the material.Pieces of dumping mainly refers to the process of PCBA processing, the SMD machine suction to the material does not paste the components to the designated location but will be thrown to the components of the disposal box or other places, or not suction to the material to carry out the above a dumping action.
Throwing will not only cause material loss, but also reduce the production efficiency and increase the production cost. Therefore, in order to improve the production efficiency and reduce the cost of the patch,throwing phenomenon is a timely solution.
As we know, usually in the PCBA processing process,there will often be the case of throwing material,throwing material not only affects the production, while throwing material is an important factor affecting the production cost.
Then the patch will appear to throw the material?The so-called throwing material refers to the laminating machine in the production process,after sucking the material is not sticking,but throwing the material to the throwing box or other places, or not sucking the material to fulfil the above a throwing action.
Throwing material to form the loss of data,prolong the production time,reduce the production power, increase the production cost,in order to optimise the production power,reduce costs,must deal with the problem of high throwing rate.
PCBA Processing
The main reason and solution of throwing material
1.Vacuum problem.
Insufficient air pressure is usually the vacuum pipe channel is blocked or there are leaks and other conditions caused by insufficient air pressure is unable to pick up the material normally,usually can not pick up or pick up after the way to stick in the fall.
Solution: Adjust the air pressure steep slope to the equipment required air pressure value (such as 0.5 ~0.6Mpa-YAMAHA laminating machine), clean the air pressure pipe, repair the leakage airway.
2.Programming problems.
The parameters of the components in the edited programme are not set correctly, and they do not match with the size and brightness of the incoming materials,so the identification failed and was lost. Countermeasure: Modify the parameters of the component and collect the best parameter setting of the component.
Solution:Modify the component parameters and search for the best parameter setting for the component.
3.Problems with incoming materials.
The incoming materials are not regular, and they are unqualified products such as oxidised pins. Countermeasure: IQC do a good job of incoming material inspection, timely defective devices, and stop the defective products outside the production line;
Solution: IQC to do a good job of incoming material inspection, and component suppliers to contact.
4.Feeder problem.
Feeder orientation deformation, feeder feeding bad (feeder ratchet gear damage, material belt holes are not stuck in the feeder ratchet gear, feeder below the foreign body, spring aging, or poor power), the formation of the feeder can not pick up the material or pick up the material poorly and thrown material, and the feeder is damaged.
Solution: adjust the feeder, clean the feeder platform, replace the damaged parts or feeder.
5.Nozzle problem
Patch machine suction nozzle deformation, clogging and so on, resulting in insufficient air pressure, air leakage and so on, which in turn can not be normal suction and take the material incorrectly, identification does not pass to produce the phenomenon of throwing material.
Solution: Clean and replace the nozzle of the laminator.
6.Identification system problems
Punching parts of the processing of the identification of the laminating machine or laser lens is contaminated, there are impurities interfere with identification, improper selection of light sources and intensity, grey scale is not enough and other reasons or identification system damage.
Solution: Clean the surface of the identification system, keep the monitor clean and free of contamination, adjust the light source intensity, grey scale, identification system damage, you need to replace the damaged parts.
7.Position problem
Material picking is not in the centre of the material, picking the material height is not correct (generally to touch the parts after the downward pressure of 0.05MM as the standard) and caused by bias bit, picking the material is not correct, there is a shift in the identification of the corresponding data parameters do not match the identification system as an invalid material to be thrown away.
Solution: Adjust the pickup position.
8.PCB quality problems
PCB thickness, the degree of warpage of the PCB board beyond the permitted degree of equipment error, PCB board support pins placed on the problem of double-sided PCB mounting, both sides of the support pins on the top of the bottom of the PCB components, resulting in upward warpage of the PCB.
Solution: Select the appropriate PCB for mounting.
The solution to these problems requires a detailed inspection of the production line to determine the root cause of the problem. Usually, it is necessary to adjust the quantity and quality of solder paste, ensure that the viscosity and temperature are correct, check whether the head is flat and intact, remove the dirt and grease on the PCB board, ensure that the size and quality of the electronic components meet the requirements, and ensure that the paste programme is set correctly. If the problem still exists, you can contact the equipment manufacturer of PCBA processing or after-sales service to get help.