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Split boards is an important process in the production process of mass electronic assembly. In order to increase the output of printed circuit boards (PCBs) and the production speed of surface mount technology (SMT) production lines, printed circuit boards are usually designed as a large board, which is divided into multiple small printed circuit boards by a board splitter in the final product. This large printed circuit board is called a concatenated board or a panel. The large board is cut into small pieces in different product processes, which may be after SMT, after the online tester (ICT), after soldering through-hole SMT, or before the final product assembly.
So what are the ways to separate boards?
1. Manual board separation: a flexible and convenient basic choice
Manual board separation is a traditional and intuitive method that relies on pliers, scissors or manual board folding tools. It is often used in small-scale production, R&D proofing, or when the accuracy of board separation is not high.
Its advantages are low operating threshold, no need for additional equipment, and can be started with simple tools. It is flexible and can handle PCB boards of various shapes and sizes, especially special-shaped boards, and can be handled flexibly based on experience.
However, the shortcomings are obvious, the accuracy depends on personal skills and experience, and dimensional deviations are prone to occur. The force is difficult to control during operation, which can easily cause the PCB board to warp and scratch, affecting the quality. Moreover, the efficiency is low and it is difficult to meet the needs of modern large-scale production.
2. Saw blade splitter: a reliable representative of mechanical cutting
The saw blade splitter uses a high-speed rotating saw blade to cut the PCB board. The saw blade is mostly made of high-speed steel or carbide, and can cut common FR-4 substrates.
It can split board in a straight line and a certain degree of curve. The accuracy is higher than that of manual splitting, which can be controlled within ±0.1mm - ±0.2mm. The cutting stress is small and the impact on components is low. It is suitable for scenes with requirements for accuracy and moderate production batches.
However, cutting will generate dust, and improper handling will pollute the environment and affect product performance. Saw blades are consumables and need to be replaced regularly, increasing costs and maintenance. And the splitting speed is slow, which is not enough in efficient production scenarios.
3. V-cut panel splitter: an efficient solution for regular panelization
The V-cut panel splitter is designed for PCB panels with V-grooves, and works by applying pressure to split them along the V-grooves.
It is highly efficient and suitable for large-scale production. Because it is separated along the pre-cut V-grooves, the accuracy can reach within ±0.1mm, which can ensure consistent size, stable panel separation, and low stress. As long as the V-groove design is reasonable, it has little impact on components.
However, its application is limited and is only suitable for regular-shaped panels. The V-groove parameters need to be set accurately, otherwise it is easy to separate the panels and the board edges are uneven. Moreover, V-groove cutting will weaken the mechanical strength of the PCB board, and the panel separation point is easy to become a weak point.
4. Punch panel splitter: a powerful and efficient large-scale panel splitter
The punch panel splitter relies on the impact force of the punch and punches the panels according to the customized mold. The panel separation speed is fast, which is suitable for large-scale and standardized production and can greatly improve efficiency.
High precision of board separation can be guaranteed by sophisticated molds to meet strict dimensional requirements.
However, it requires customized molds, with high development costs and long cycles. When product designs are changed, molds often need to be remade, which has poor flexibility. The stamping stress is large, which can easily damage sensitive components on PCB boards. It is suitable for large-scale production with strong component tolerance and pursuit of high efficiency.
5. Milling cutter board separation machine: an expert in accurate and flexible curve board separation
The milling cutter board separation machine uses a high-speed milling cutter to cut according to the programming path, which can achieve board separation of any shape and has excellent ability to handle irregular PCB boards.
The cutting stress is small, almost no damage to components, the edges are smooth and burr-free, no secondary processing is required, and different board separation requirements can be quickly adapted by adjusting the programming.
However, the equipment purchase cost is high, and the milling cutter needs to be replaced regularly, which increases the operating cost. And the cutting speed is relatively slow, which has limitations in large-scale and efficient production.
6. Laser depaneling machine: a pioneer in precision depaneling driven by high technology
Laser depaneling machines use high-energy laser beams to instantly melt or vaporize materials to depanel, and are increasingly used in the field of high-end electronic manufacturing.
It has extremely high precision, up to ±0.01mm or even higher, no mechanical contact, no stress, can guarantee product performance, can be processed non-contact, has a small heat-affected area, and has good edge quality.
However, the equipment is expensive, has high maintenance costs, and has a slow depaneling speed, which limits its application in large-scale, high-efficiency production scenarios. It is mainly used in aerospace, high-end medical equipment and other fields with extremely high precision requirements.
Precautions for machine split board:
Stable support points, without support, the stress generated may damage the substrate and welding points. Distorting the board or generating stress on the assembly during depaneling may cause hidden or obvious defects.
Wear protective tools, and be sure to make protective preparations before operating. High-frequency eye protection lighting devices need to be installed to protect the safety of the operator. It is best to wear a pair of glasses to protect the safety of the eyes.
Use alcohol to wipe the machine spindle and tool frequently to remove the PCB dust generated during the board separation process and maintain the normal operation of the board separation machine.
After a certain number of uses, the slide bar and bearings of the board separation machine should be lubricated and checked for loose screws.
During the use of the machine, the work surface should be kept clean. It is best not to place other things to avoid things falling on the tool and causing damage to the tool and items. Although there are electric eyes for maintenance, it is still necessary to pay attention to keeping a certain safe distance between fingers and tools during the use process.
In the field of electronic manufacturing, there are various ways to split boards, each with its own advantages and disadvantages. If you have any questions about the selection and application of spliting boards, or need professional advice, please feel free to contact us. We will provide you with comprehensive and personalized support with our rich experience to help you make the best decisions in the journey of electronic manufacturing and achieve production goals efficiently.