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PCBA and PCB after years of development, its emergence is another important invention in our human history. Humans invented technology, technology to promote science and technology, resulting in today's developed and convenient life. Development to date, we should thank our excellent predecessors.
In 1941, the U.S. coated talcum powder with copper paste for wiring to make a near fusible link.
In 1943, the Americans popularized this technology in military radios.
In 1947, epoxy resin was used to make substrates. At the same time, NBS began researching manufacturing techniques for coils, capacitors, and resistors formed by printed circuit technology.
In 1948, the invention was officially approved for commercial use in the United States.
In 1950, when vacuum tubes were replaced by low-heat transistors, printed circuit boards began to be widely used. Etched foil technology was the mainstay at that time.
In 1950, Japan used silver paint to lay lines on glass substrates; paper phenolic resin phenolic substrates (CCL) were laid with copper foil.
In 1951, polyimide was introduced to make the resin more heat-resistant, and polyimide-based boards were produced.
In 1953, Motorola developed the dual-panel through-hole plating method, which was also applied to later multi-layer PCBs. PCBs were widely used for 10 years in the 1960s, and the technology matured. Motorola's dual-panel, multi-layer PCBs began to appear, allowing for even greater improvements in wiring and substrate area ratios.
In 1960, V. Dahlgreen made FPCs by pasting foils with printed circuits onto thermoplastic.
In 1961, Hazeltine Corporation, headquartered in the U.S., introduced the electroplated perforation method for the production of multi-layer PCBs.
In 1967, plating technology was introduced as one of the layering methods.
In 1969, FD-R manufactured FPCs with polyimide.
In 1979, Pactel published a layup method, the “Pactel Method”.
In 1984, NTT developed the “Copper Polyimide Method” for thin film circuits.
In 1988, Siemens Ag developed an extension PCB for Microwiring Substrate.
In 1990, IBM developed Surface Layered Circuit (SLC) for its expansion PCBs.
In 1995, Matsushita Electric developed the ALIVH extension PCB.
In 1996, Toshiba developed the B2it extension PCB.
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History is progressing,technology is advancing,we have to keep moving forward, but don't forget to own the technology.