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What is Solder Paste Inspection? Solder Paste Inspection (SPI) is a key component in ensuring the quality and performance of solder paste in electronics manufacturing, especially in Surface Mount Technology (SMT).
Solder Paste (Solder Paste): Solder Paste is a new type of soldering material that came into being along with SMT, it is a paste mixture formed by mixing solder powder, flux and other surfactants, thixotropic agents, etc. Its main purpose is to be used in the SMT industry. Its main purpose is used for SMT industry PCB surface resistance, capacitance, IC and other electronic components welding.
SPI is a core part of the SMT placement process, in which it plays several key roles:
Precision inspector of SMD quality: SPI is like a highly skilled craftsman, carefully inspecting and verifying every detail of the solder paste in the complex process of SMT placement. The solder paste is precisely printed on the circuit board component pads by stencils, like a carefully mixed artist's paint, and SPI acts as a guardian to ensure that the paste is evenly distributed, in the right quantity and in the right place.
Early warning of soldering defects: The SPI system acts as a keen detective, detecting parameters such as thickness, position and shape of the solder paste. It detects and prevents soldering defects such as missing paste, excess paste or offsetting, ensuring impeccable soldering quality.
A powerful enabler of productivity: While monitoring solder paste quality in real time, SPI builds a solid line of defence that reduces subsequent process failures due to solder paste problems, thus significantly improving productivity. It provides immediate feedback so that problems can be quickly exposed and resolved.
The leader in automated inspection: With its automation and high efficiency, the SPI system completes a comprehensive inspection of the entire board's solder paste adhesion in a very short time. It is like a tireless guardian of the production line, its speed and accuracy far exceed the manual inspection.
The Wise Man of Data Insight: The SPI system is not only an excellent inspector, but also a wise data recorder. It records and generates detailed inspection reports, which act as a valuable resource for quality control, process improvement and product traceability. Through in-depth analysis of these data, manufacturers can accurately adjust the production process and promote the continuous optimisation of product quality.
Solder Paste Testing Items
Flux Content Test
Flux content refers to the amount of flux in the solder paste, usually expressed as a percentage. The flux content of solder paste has a significant impact on solder quality and stability. Therefore, it is necessary to test the flux content in solder paste.
Metal content testing
The metal content of solder paste is one of the key factors affecting the performance and soldering effect of solder paste. Reasonable metal content can make the solder paste in the soldering process to form a good solder joint, improve the welding strength and reliability. At the same time, the metal content is also related to the printing performance, stability and environmental protection of the solder paste. Therefore, it is very necessary to test the metal content of solder paste.
Viscosity Test
The appropriate viscosity of the paste can ensure that in the printing process to maintain a clear outline, to avoid collapse or penetration, and at the same time can ensure that in the soldering process, uniform distribution, the formation of good solder joints. Too high or too low a viscosity will lead to a decline in viscosity printing quality. Therefore, it is essential to test the viscosity in solder paste.
Alloy powder particle size and size distribution detection
Solder paste alloy powder particle size refers to the size distribution of tin balls in the solder paste, usually described using the particle diameter. The smaller the particle size of the solder paste alloy powder, the better the elasticity and mobility, but when the particles are small to a certain extent, it is easy to have bad soldering, leakage soldering and other problems. And the larger the particle size of the solder paste, the easier it is to block the aperture, the decline in throughput performance and other problems. Therefore, it is very necessary to detect the particle size and size distribution of alloy powder in solder paste.
Inspection scope
1. Tin powder particle size and uniformity: applicable to all types of solder paste, especially for high-precision electronic manufacturing.
2. Solder paste viscosity and consistency: for SMT processes that require precise printing.
3. Printing penetration: suitable for soldering applications where good wetting is required.
4. odour and toxicity: suitable for all electronic manufacturing environments, especially where health is a concern.
5. metal content: suitable for all types of solder pastes, especially for applications with high purity requirements.
6. Collapse test: for soldering applications where collapse prevention is required.
7. solder ball test: for soldering applications where protection against solder ball defects is required.
8. Wettability test: for welding applications requiring good wettability. 9.
9. chemical resistance: for welding applications exposed to chemical environments.
10. Negative Pressure Resistance: For welding applications requiring exposure to negative pressure.
11. Processability: Suitable for all SMT processes, especially applications that require precise printing.
12. Impact Resistance: Suitable for soldering applications that require impact resistance.
13. Weathering: For soldering applications that require long-term exposure to outdoor environments.
14. Compositional analysis: for all types of solder pastes, especially for applications requiring precise compositional control.
15. Failure diagnostic analysis: for all types of solder pastes, especially for applications requiring improved performance.
Solder Paste Inspection (SPI) plays a vital role in SMT placement processing, ensuring solder paste quality, improving productivity and providing valuable data to support manufacturers. As technology continues to advance, SPI will continue to drive electronics manufacturing towards higher quality and efficiency.