sales@ipcb.com
SMT is an acronym for Surface Mounted Technology, which is one of the most popular technologies and processes in the electronic assembly industry today.
Surface Mount Technology (SMT), known as surface mount or surface mount technology. It is a pinless or short lead surface assembly components (SMC / SMD, Chinese called chip components) installed in the printed circuit board (Printed Circuit Board, PCB) on the surface or the surface of other substrates, through the re-flow soldering or dip-soldering and other methods to be soldered to the circuit assembly connected to the PCBA (Printed Circuit Board Assembly). Board Assembly).
The factories that use this type of technology for production are SMT factories.
SMT Factory
SMT process is a kind of technology to adapt to the development of electronic products more and more to miniaturise and thin,and it is also one of the most popular technology and process in the PCBA electronic assembly industry,and it is also the first choice of many PCBA processes nowadays.Today,we will introduce some SMT process flow to you.
SMT basic process components include:silkscreen (or dispensing), mounting (curing), reflow soldering,cleaning,testing,rework.
1.Silk-screen:the use of laser stencils will be solder paste or patch adhesive leakage printed on the PCB pad,in preparation for the welding of components.The equipment used is silk screen printing machine (screen printing machine), SMT patch mesh,located in the forefront of the SMT production line.
2.Dispensing:It is the glue drops to the fixed position of the PCB board,its main role is to fix the components to the PCB board.The equipment used is dispensing machine,located at the front of the SMT production line or behind the inspection equipment.
3.Paste: Its role is to accurately install the surface assembly components to the fixed position of the PCB.The equipment used is the laminating machine, which is located behind the silk screen printing machine in the SMT production line.
4.Curing: Its role is to melt the adhesive, so that the surface assembly components and PCB board firmly bonded together. The equipment used is the curing oven, located in the SMT production line behind the SMD machine.
5.Reflow soldering: its role is to melt the solder paste, so that the surface assembly components and PCB board firmly bonded together. The equipment used is a reflow soldering furnace, located in the SMT production line in the back of the SMD machine.
6.Cleaning: Its role is to assemble the PCB above the harmful soldering residues such as flux removed.The equipment used for the cleaning machine, the location can not be fixed, can be on-line, but also not on-line.
7.Inspection: Its role is to assemble the PCB board for welding quality and assembly quality inspection.The equipment used are magnifying glass, microscope, in-line tester (ICT), flying probe tester, automatic optical inspection (AOI), X-RAY inspection system, functional testers and so on.Position according to the needs of inspection, can be put aside in the SMT production line in the appropriate place.
8.Rework: its role is to rework the PCBA SMT inspection failure.The tools used are soldering iron,rework workstation.Put aside in the SMT production line in any position.