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HDI (High-Density Interconnect) circuit boards with anylayer boards are an advanced circuit board design that allows for any number of layers of interconnect structures to realize complex circuit connections through flexible laser drilling and stacking techniques. Anylayer HDI boards are designed to optimize the board's performance and improve its stability and reliability.
HDI anylayer PCB vs Conventional FR4 Multilayer PCB
The main feature of anylayer HDI boards is the ability to realize laser interconnections from the PCB core board, providing higher wiring density.
- Connection Density: Achieve higher connection density in limited space to meet the demand for integration and functionality to carry complex circuit structures.
- Size and Lightweight: Reduced size makes electronic devices lighter and thinner, suitable for smartphones, tablets, and other electronic products with high volume requirements.
- Signal performance: Smaller size and higher density effectively reduce signal noise and electromagnetic interference, making it suitable for high-speed applications.
- More effective heat dissipation: enables better management of RFI, EMI, and electrostatic discharge issues.
anylayer HDI PCB
HDI anylayer PCB have very high technical requirements in the production process, covering a wide range of aspects such as materials, processes, and equipment. HDI anylayer PCBs utilize micro-blind and buried hole technologies designed to achieve high circuit densities. The manufacturing process must use advanced processes such as laser drilling, lamination, copper plating, etc. to achieve its design goals and reach the required electrical performance indexes. HDI anylayer PCBs have strict requirements on the selection of materials to achieve higher signal integrity and reliability and require the use of substrate materials with good electrical properties and thermal stability. Production equipment is required to have high precision and stability, and manufacturers are also required to have stricter production control.
The manufacturing process of HDI PCB is complex and involves multiple processes, such as laser drilling, copper plating and filling, and stacking, etc. The parameters of each process need to be accurately controlled, including the limitation of the size of the over-hole, the sequence of stacking, and the thickness of each layer of material.