Product: Optical communication transceiver module
Layer: 8L
Base plate: TG170 FR4
Stack-up: 2+4+2 HDI PCB
Finished board thickness: 0.8mm
Copper board thickness: 0.5oz (17 μ m)
Surface treatment: chemical gold + electroplated hard gold
Minimum line width/space: 3/3 mil (75 / 75 μ m)
Special process: gold finger bevel edge, strict tolerance
Product application: Optical communication transceiver module