sales@ipcb.com
FPC flexible overflow refers to the problem of glue stains on FPC flexible circuit board PAD due to the flow of glue line in COVERLAY caused by the temperature rise during the pressing process.
There are many reasons for FPC flexible overflow, so we should propose different solutions according to the specific situation.
FPC flexible
1.Glue overflow is caused by the manufacturing process.
FPC FLEXIBLE circuit board manufacturers should strictly check the incoming materials.If the overflow of the incoming material exceeds the standard,contact the supplier to return or replace the goods. Otherwise, it is difficult to control the overflow in the production process.
2.Glue overflow is caused by the storage environment.
FPC flexible circuit board manufacturers had better set up a special refrigerator to save the protective film.If the CL gel is affected by moisture due to the preservation conditions do not meet the requirements,you can use low-temperature pre-drying of the CL to a greater extent to improve the overflow of CL.
In addition,the CL that is not used up on that day should be put back to the refrigerator in time for storage.
3.Small independent PAD position causes localized overflow.
This phenomenon is one of the most common quality anomalies encountered by most domestic FPC FLEXIBLE circuit board manufacturers. If you change the process parameters simply to solve the overflow problem, it will bring new problems such as insufficient air bubbles or insufficient peel strength, so you can only adjust the process parameters reasonably.
4.Overflow caused by operation mode
FPC FLEXIBLE circuit board misconnection, require employees to accurately align, calibrate the alignment fixture, and increase the intensity of the alignment check, to avoid overflow of plastic alignment caused by inaccuracies.
At the same time to do a good job of crimping false connection of the “5S”, check the protective film CL whether there is pollution and burrs before alignment.