High Speed Circuit

Product Name: High Speed PCB

Substrate: Panasonic Megtron6 (M6)

Layer: 16L

Finished thickness: 1.2mm

Copper thickness: 1/H/H/1oz

Minimum line width/spacing: 4mil/4mil

Surface treatment: ENIG

Minimum mechanical hole: 0.2mm

Laser blind hole: 0.1mm

Product application: Communication equipment

Product: AI Server PCB

Material: High-Tg FR4, PTFE, CCL

Layer Count: 20-28 layers

Copper Thickness: 1.0 oz

Finished PCB Thickness: 4mm

Solder Mask Colour: Green, Red, Blue, Black

Surface Finish: ENIG, HASL, No-Electroless Gold, Immersion Silver

Application Areas: Motherboards, Computing Units, Power Management, High-Speed Interfaces and Storage Control

Product Name: Drone Antenna

Substrate: High TG FR4

Layer Count: 4-16 layers

Finished Thickness: 1.6mm

Copper Thickness: 1mil

Minimum Line Width/Spacing: 0.5mm/0.5mm

Surface Finish: Immersion Gold

Minimum Mechanical Hole Diameter: 0.3mm

Laser Blind Hole: 0.1mm

Product Applications: Power line inspection, communication equipment

Model: Optical Module Printed Circuit Board (PCB)

Layers: 6 to 16 layers

Materials: TG170, FR4, Polyimide, ITEQ IT968TC, Shengyi S1000-2M

Structure: 2+4+2 High-Density Interconnect (HDI) PCB

Final Thickness: 0.4 to 1.0 mm

Copper Thickness: 1 to 2 ounces (OZ)

Color Options: Green or White

Surface Finish: Electroplated Hard Gold

Special Feature: Beveled Gold Fingers

Minimum Trace/Space: 3 mils / 3 mils

Applications: Utilized in communication equipment, data centers, high-performance computing (HPC), and artificial intelligence (AI) to meet high-speed data transmission and computational power requirements.

Product name: 20L high-speed PCB

Substrate: TU872LK

Layer: 20L

Finished thickness: 3.2mm

Copper thickness: 1oz (35 μm)

Solder mask: green/white

Minimum line width/line spacing: 4mil/4mil

Surface treatment: electroplated hard gold 3-15u"

Blind hole: L3-L20

Product application: Communication base station backplane

Product Name: IC Test Board

Layer: 46L

Material: 85N

Finished thickness: 6.0mm

Copper plating thickness: 1oz

Surface treatment: ENIG+gold plating

Minimum line width/spacing: 2.5mil/2.5mil

Minimum aperture: 0.1mm

Aperture ratio: 48:1

Product application: ATE, Semiconductor testing

Product name: Probe card board

Base plate: VT901, 85N

Layer: 48L

Finished size: 20"*22"

Stacking: L1-L48 10mil

               L1-L28 12mil

               L29-L48 14mil

Surface treatment: Hard gold plating 3-15μ"

Special process: metal edging, fixed depth drilling

Product Application: Wafer Test Board

Product name: Load Board

Base plate: TUC/TU872HF

Layer: 56L

Finished size: 20"*22"

Stacking: L1-L56 10mil

L1-L28 12mil

L32-L56 14mil

Surface treatment: Hard gold plating 3-15μ"

Special process: metal edging, fixed depth drilling

Product Application: Wafer Test Board

Product name: Burn In Board (BIB)

Material: High TG FR4

Layer: 16L

Finished size: 20"*22"

Surface treatment: Immersion Gold

Flatness: 0.3%

Product Application: Chip Burn in testing

Product Name: Interposer Board

Substrate: FR-4

Layers: 2-10L

Thickness: 1.6mm

Solder mask: green, blue

Screen: white

Surface treatment: immersion gold (ENIG)

Product application: Semiconductor testing, ATE