sales@ipcb.com
Due to user demand and national investment in two wheel drive, 5G has taken the lead in developing PCB communication. As early as the 4G era, global mobile Internet traffic has soared. According to the statistics of the Ministry of Industry and Information Technology, the domestic mobile Internet traffic has doubled annually, far higher than the global average growth rate of 15%. The emergence of high-definition video, Internet of Things, VR/AR and other application scenarios has put forward strong requirements for enhanced mobile broadband, massive connections, low latency, and high reliability communication technologies. 5G, as a breakthrough mobile communication technology, will lead a new era of communication development driven by user demand and national investment.
Every decade in the mobile communication cycle, China will lead the world in the 5G era after experiencing "2G follow-up, 3G breakthrough, 4G synchronization".
Although China Mobile lags behind the world in 1G to 4G, it is still striving to catch up. In the 4G era, China's dominant TDD communication system will become the mainstream system of 5G. In the 5G era, China has taken the initiative to establish an IMT-2020 promotion team, leveraging the entire industry chain to promote the development of 5G technology standards, and is expected to lead in both technology and market.
In 2018, China will enter a critical turning point in the promotion of 5G, and the commercial time is expected to exceed expectations.
The 5G pilot work of China IMT-2020 Promotion Group is divided into two stages: technology research and development trials (2015-2018) and product research and development trials (2018-2020). In 2017, China established the world's largest 5G field test base in Huairou, Beijing. On January 16, 2018, the China IMT-2020 Promotion Group released the "5G Technology Research and Development Trial Phase III Specification". China Mobile announced that it will launch pilot programs in 12 cities across the country, while China Unicom has submitted youth pilot associations in 7 cities and completed on-site construction in Shanghai and Shenzhen. We expect the large-scale pilot of 5G in China to start in the second half of 2018 and enter the trial period in 2019. The issuance of 5G commercial licenses may exceed expectations.
Taking history as a mirror, looking forward to the future pattern of the 3G/4G 5G industry chain, the upgrading of 5G networks and terminal software and hardware will bring profound changes to industrial refining and industrial models. Operator: The right to dialogue with China. In the 3G/4G era, the global operator market continues to integrate and concentrate. In the 5G era, mainstream operators such as Vodafone and China Mobile have strong capabilities, and Chinese operators will have global discourse power. Main equipment suppliers: Strong leadership in the industry chain, huge opportunities for upstream equipment. Huawei, ZTE, Ericsson, and the new Nokia are all standing at a height of four feet.
In the 5G era, Chinese manufacturers will further squeeze the market share of European manufacturers, bringing opportunities for the localization of upstream equipment. RF equipment: There are many participants in 4G, and the gross profit margin of the traditional RF equipment industry is relatively low. Due to the large-scale MIMO application of 5G, 2/3 of the antenna added value will be transferred to the PCB where the antenna oscillator is installed. According to global PCB service card providers, the combination of ultra-high density network technology will bring new opportunities for PCB and high-frequency copper-clad laminate materials. The optical device industry: With the fluctuation of 3G/4G cycles, the concentration of the entire industry continues to decline.
Due to Massive MIMO applications in 5G, 2/3 of the antenna added value will be transferred to the PCB where the antenna oscillator is installed. According to the global PCB service card provider "Jiduobang", the combination of ultra-high density network technology will bring new opportunities for PCB and high-frequency copper-clad laminate materials. The optical device industry: With the fluctuation of 3G/4G cycles, the concentration of the entire industry continues to decline. In the 5G era, the network investment of operators overlaps with the investment cycle of Internet data centers, and Chinese manufacturers emerge as the times require. Fiber optic cable industry chain: presenting a pyramid shaped industrial structure, manufacturers with integrated production capabilities of optical rods, optical fibers, and optical cables will continue to maintain their competitive advantages, and the concentration of the industry will further increase.
5G applications
IPCB is a PCB manufacturing factory in China, specializing in the production of radio (microwave) frequency boards, HDI multilayer boards, blind buried PCBs, rigid flexible PCBs, and more.
5G circuit board materials
Data shows that functional fillers are the main bearers of mechanical strength in substrate composite materials, and are therefore generally regarded as one of the most important research directions in the technological upgrading of copper-clad laminates. As the main data for processing and manufacturing circuit boards (PCBs), copper-clad laminates can be used for the production of high-speed transmission equipment such as servers and memory, as well as components such as antennas, amplifiers, and radars. They are widely used in the fields of electronic products such as televisions, radios, computers, and mobile communications.
In 5G base stations, circuit boards made of copper-clad laminates are mainly used to produce communication equipment such as base station antennas and amplifiers, which are installed in communication networks. Due to the significant increase in communication frequency and transmission speed brought about by the upgrade of 5G communication technology, traditional copper-clad laminates cannot meet the production requirements, and high-frequency and high-speed copper-clad laminates have become the main development trend of copper-clad laminates at present.
To meet the needs of high-frequency and high-speed data transmission, high-performance circuit substrates have become a necessary choice for producing high-frequency and high-speed copper-clad laminates. At present, with excellent dielectric constant and low dielectric loss performance, silicon dioxide data as enhanced data filled in polytetrafluoroethylene (PTFE) substrates has become the main technical route for high-frequency and high-speed copper-clad laminates. After adding silica functional fillers, the dielectric properties and signal transmission quality of high-frequency and high-speed copper-clad laminates can be improved, thus meeting the quality requirements of 5G communication. At the same time, silicon dioxide functional fillers effectively improve the heat resistance and reliability of PCBs.