PCB Bolg

2025-07-15

​The pcb board assembly process is the most critical step in developing any electronic product.

2025-07-11

In the context of PCBs, a metallic substrate refers to a structure that uses a metal (typically aluminum, copper, or steel) as the base material instead of a pure dielectric or resin system.

2025-07-10

A four-layer PCB is composed of four layers, including: top layer, bottom layer, signal layer (inner layer 1), power/ground layer (inner layer 2)

2025-07-10

Through-hole is a microscopic conductive pathway drilled into a PCB to create an electrical connection between different PCB layers.

2025-07-04

While FFCs and FPCs share similarities in providing flexibility and compact form factors, their respective connectors require careful selection and integration to ensure mechanical reliability and electrical performance.

2025-07-03

Wire bonding equipment, as the core tool of the packaging link, undertakes the important task of realizing the electrical connection between the chip and the external circuit.

2025-07-01

​In the field of electronic manufacturing, PCB circuit testing is a key link to ensure product quality.

2025-07-01

​RF interference(RFI) can be described as the effects of unwanted RF energy in a system, which manifests itself as performance degradation, data loss, equipment damage, etc.

2025-06-26

​PCB bare boards will experience PCB warpage during PCBA assembly, affecting their yield. I

2025-06-26

FPC stiffener board plays an important role in providing mechanical support for FPC, because FPC flexible circuit boards are flexible, but rigidity is required in certain places.