Product name: Photographic lens rigid-flex PCB
Substrate: FR-4+PI
Layer: 4-6L
Finished plate thickness: 0.3mm
Copper plating thickness: 0.012mm/0.025mm
Surface treatment: electroplated nickel-palladium
Product application: mobile phone camera lens module
The birth and development of FPC and PCB gave birth to new products of (r-fpcb). Therefore, rigid-flex PCB is a circuit board with FPC characteristics and PCB characteristics, which is formed by rigid-flex PCB according to relevant process requirements.
The rigid-flexible PCB (r-fpcb) used for the camera module must not only meet the ultra-thin, high-flatness functional structure, but also have the unique functions of the rigid-flexible PCB (r-fpcb), flatness The components and chips after pasting can still remain in good condition.
Mobile phone camera module
The laser-cut offset detection pads are etched on the circuit board, and there is no copper on the inner and outer layers of the laser-cut path. Two adjacent cameras can share the longest laser cutting line on rigid-flex PCB(r-fpcb). Although the thickness problem is solved through the layout structure, there is no good structure to solve the heat dissipation and strength problems.
Product name: Photographic lens rigid-flex PCB
Substrate: FR-4+PI
Layer: 4-6L
Finished plate thickness: 0.3mm
Copper plating thickness: 0.012mm/0.025mm
Surface treatment: electroplated nickel-palladium
Product application: mobile phone camera lens module
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