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High density interconnect (HDI) printed circuit board utilize the latest technology to increase the use of printed circuit board in the same or smaller area. This has driven significant advancements in mobile and computer products, resulting in revolutionary new products. This includes touch screen computers and 4G communication, as well as military applications such as aviation electronic devices and intelligent military equipment.
The characteristic of high-density interconnect (HDI) printed circuit board is their high-density properties, including laser micro holes, fine wires, and high-performance thin materials. This increased density supports more functions per unit area. High tech high-density interconnect (HDI) printed circuit board contain multiple layers of stacked copper filled micropores (high-order HDI printed circuit board), which can be used to create more complex interconnects. These very complex structures provide necessary wiring solutions for high pin count chips used in today's high-tech products.
HDI stands for High Density Interconnector, a manufacturing printed circuit board that uses insulating materials and conductive wiring to form structural components. When a printed circuit board is made into a final product, integrated circuits, transistors (transistors, diodes), passive components (such as resistors, capacitors, connectors, etc.), and various other electronic components are installed on it. By using wires to connect, electronic signal connections and necessary functions can be formed. Therefore, a printed circuit board is a platform that provides component connections and serves as a substrate for connecting components.
Electronic design is constantly improving overall performance while also striving to reduce its size. From mobile phones to small portable products such as smart weapons, 'small' is an eternal pursuit. High density integration (HDI) technology can make terminal product design more compact while meeting higher standards for electronic performance and efficiency. HDI is widely used in mobile phones, digital cameras, MP3 players, MP4 players, laptops, automotive electronics, and other digital products, with mobile phones being the most widely used. HDI board are generally manufactured using the Build up method, and the more layers are applied, the higher the technical level of the board. Ordinary HDI board are basically single layer stacked, while high-order HDI uses two or more layer stacking techniques, as well as advanced PCB technologies such as stacking holes, electroplating filling holes, and laser direct drilling. High end HDI board are mainly used in 3G mobile phones, advanced digital cameras, IC carrier board, etc.
Advantages of HDI Board
1. Can reduce PCB costs: When the density of the PCB increases beyond eight layers, using HDI board for manufacturing will result in lower costs compared to traditional complex lamination processes.
2. Increase line density: Interconnection between traditional circuit board and components
3. Beneficial for the use of advanced construction technology
4. Have better electrical performance and signal accuracy
5. Better reliability
6. Can improve thermal properties
7. Can improve radio frequency interference/electromagnetic wave interference/electrostatic discharge (RFI/EMI/ESD)
8. Increase design efficiency
HDI printed circuit board
1+N+1- Printed circuit board containing high-density interconnect layers
I+N+I (I ≥ 2) - A printed circuit board containing two or more high-density interconnect layers. The micropores in different layers can be staggered or stacked. Multilayer stacked copper filled micropores are common in challenging designs.
High density interconnect board (HDI) - All layers of a printed circuit board are high-density interconnect layers, which allow conductors on any layer of the PCB printed circuit board to be freely connected to each other through multiple layers of stacked copper filled micropores ("any layer conductive holes"). This provides a reliable interconnect solution for highly complex high pin count components, such as CPU and GPU chips on handheld devices.
Micro pores are formed by laser drilling, typically with diameters of 0.006 "(150 μ m), 0.005" (125 μ m), or 0.004 "(100 μ m). They are optically aligned with the corresponding pad diameters, typically 0.012" (300 μ m), 0.010 "(250 μ m), or 0.008" (200 μ m), so they can be optically aligned with the corresponding pad diameters to achieve higher distribution
Linear density. Micro pores can be directly designed on the pad or offset from each other. They can be staggered or stacked. They can be filled with non-conductive resin and plated with copper on the surface or directly plated to fill the holes. Micro hole design is very valuable when wiring fine pitch BGA, such as chips with a pitch of 0.8 mm or less.
In addition, staggered micropores can be used when wiring components with a spacing of 0.5mm; However, through inverted pyramid routing technology, micro BGA routing (such as 0.4mm, 0.3mm, or 0.25mm pitch components) requires stacking micro holes.
IPCB has many years of experience in producing high-density interconnect HDI products and is a pioneer in the second generation of micropores or stacked micropores. The IPCB provides a true copper stacked micro hole support for micro BGA wiring solutions.
