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PCB with buried holes and blind holes are not all HDI PCB. HDI PCB generally have blind holes, but buried holes are not like this. This depends on the order of your product and the PCB stacking.
The difference between HDI buried hole and HDI blind hole
The first and second layers of the 6-layer PCB are used for wrenches that require laser drilling, namely HDI PCB.
6-layer first-order HDI PCB refers to blind holes: 1-2, 2-5, 5-6, which require laser drilling.
6-layer second-order HDI PCB refers to blind holes: 1-2, 2-3, 3-4, 4-5, 5-6. It requires 2 laser drilling holes. First drill 3-4 buried holes, continue to press 2-5, then drill 2-3 and 4-5 laser holes for the first time, press 1-6 again for the second time, drill 1-2 and 5 again for the second time, and finally drill the -6 laser hole. It can be seen that the second-order HDI PCB has undergone two rounds of pressing and two rounds of laser drilling.
The additional second-order HDI PCB are also divided into: second-order HDI PCB with staggered holes and second-order HDI PCB with stacked holes. The second-order HDI PCB with staggered holes refers to the separation of blind holes 1-2 and 2-3 from each other, while the stacked hole Step HDI PCB refers to the stacking of blind holes 1-2 and 2-3 together. For example, blind holes such as 1-3, 3-4, 4-6, etc. are the same for third-order, fourth-order, etc.
HDI printed circuit board
HDI PCB is a circuit board with high-density interconnection characteristics, which achieves fine connections between circuits through the use of advanced process technology. This technology has higher wiring density, smaller aperture, and thinner board thickness, thereby improving the performance and reliability of circuit boards. HDI circuit boards are widely used in consumer electronics products such as smartphones, tablets, and wearable devices, providing strong support for the lightweight and high-performance development of products.
Holes with a diameter less than 150um are known as microvias in the industry. Circuits made using the geometric structure technology of these microvias can improve assembly, space utilization, and other benefits, while also being necessary for the miniaturization of electronic products.
There have been multiple different names used in the industry to refer to circuit boards with this type of structure. For example, European and American companies once called their products SBU (Sequence Build Up Process) because the programs they produced used a sequential construction method, which is generally translated as "sequential layering method". As for Japanese companies, the manufacturing technology for such products is called MVP (Micro Via Process) because the pore structure produced by these products is much smaller than previous ones, which is generally translated as "Micro Via Process". Some people also refer to traditional multilayer boards as MLB (Multi Layer Board), and therefore call these types of circuit boards BUM (Build Up Multilayer Board), which is generally translated as "Layer Up Multilayer Board".
As a professional PCB supplier, IPCB focuses on high-precision dual/multi-layer PCB factories, HDI PCB, thick copper plates, blind hole PCB, high-frequency circuit PCB manufacturing, PCB sample and PCB mass production.