PCB Bolg

2025-07-23

Countersink hole has become an indispensable technology in high-density interconnect boards (HDI) and precision electronic devices by optimizing spatial layout and mechanical stability.

2025-07-23

As the third-generation electronic packaging substrate technology, metal ceramic PCB is becoming the core carrier of power electronics.

2025-07-18

Flux is a chemical cleaning agent used in the soldering process to facilitate the formation of strong, conductive, and durable joints between electronic components and PCB pads.

2025-07-18

FPC (Flexible Printed Circuit) is a type of printed circuit board (PCB) that uses a flexible substrate, allowing it to bend and flex.

2025-07-18

Stencil with frame and stencil without frame are key process tools, and they are often confused because of their similar names

2025-07-15

​The pcb board assembly process is the most critical step in developing any electronic product.

2025-07-11

In the context of PCBs, a metallic substrate refers to a structure that uses a metal (typically aluminum, copper, or steel) as the base material instead of a pure dielectric or resin system.

2025-07-10

A four-layer PCB is composed of four layers, including: top layer, bottom layer, signal layer (inner layer 1), power/ground layer (inner layer 2)

2025-07-10

Through-hole is a microscopic conductive pathway drilled into a PCB to create an electrical connection between different PCB layers.

2025-07-04

While FFCs and FPCs share similarities in providing flexibility and compact form factors, their respective connectors require careful selection and integration to ensure mechanical reliability and electrical performance.