PCB Technology

2023-02-01

Today iPCB introduces in detail the principle and advantages of laser processing of ceramic circuit boards.

2023-01-31

Directly embedded in the PCB metal copper block, is one of the effective ways to solve the problem of heat dissipation. However, the existing production process exists copper and substrate bonding force is insufficient.

2023-01-30

Aluminum based copper clad laminate is a metal-based copper-clad laminate with good heat dissipation function. It generally consists of a three-layer structure of circuit layer (copper foil), insulation layer and metal base layer.

2023-01-20

The use of high Dk circuit board materials is a common method of realising small-size high-frequency circuits.

2023-01-18

Teflon boards are made of Teflon raw materials through molding or extrusion. According to the different Teflon raw materials and industry claims and main applications.

2023-01-17

The most basic part of making a wafer is design->fluidisation->packaging->testing. The cost structure of a wafer is generally 20% of manpower cost, 40% of flow, 35% of packaging, and 5% of testing [for advanced processes.

2023-01-14

If you compare "Flexible and Rigid board" with "FPC flexible board + PCB circuit board + connector", the biggest disadvantage is that the price of "Flexible and Rigid board" is more expensive.

2022-11-06

Advantages and Disadvantages of OSP Process,Simply put, OSP is the chemical growth of an organic film on a clean bare copper surface. Because it is organic and not metal, it is cheaper than tin spraying.

2022-11-06

LTCC microwave dielectric ceramics classification, LTCC ceramic materials in accordance with the function can be divided into: LTCC substrate and packaging data, LTCC microwave components data.

2022-10-31

The process flow of ltcc technology