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PCB Technology

PCB Technology

PCB Technology

PCB Technology

PCB Substrate Material Introduction

2023-02-04

PCB substrates are classified as 94HB, Fire Rated (94VO, FR-1, FR-2), Semi-Glass Fibre (22F, CEM-1, CEM-3), Full Glass Fibre (FR-4).

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Aluminium Oxide Ceramic Substrates Development

2023-02-01

Alumina ceramic substrate heaters, i.e. metal ceramic heaters (hereinafter referred to as "MCH") use high temperature co-fired multi-layer ceramic substrate technology.

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Laser Processing of Ceramic Boards Principles and Advantages

2023-02-01

Today iPCB introduces in detail the principle and advantages of laser processing of ceramic circuit boards.

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Embedded copper block circuit board process and procedure

2023-01-31

Directly embedded in the PCB metal copper block, is one of the effective ways to solve the problem of heat dissipation. However, the existing production process exists copper and substrate bonding force is insufficient.

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Product Features of Aluminum Based Copper Clad Laminate

2023-01-30

Aluminum based copper clad laminate is a metal-based copper-clad laminate with good heat dissipation function. It generally consists of a three-layer structure of circuit layer (copper foil), insulation layer and metal base layer.

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How to select different values dielectric constant for circuit board data

2023-01-20

The use of high Dk circuit board materials is a common method of realising small-size high-frequency circuits.

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Teflon board performance and application

2023-01-18

Teflon boards are made of Teflon raw materials through molding or extrusion. According to the different Teflon raw materials and industry claims and main applications.

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What IC tests are required for IC chip manufacturing process?

2023-01-17

The most basic part of making a wafer is design->fluidisation->packaging->testing. The cost structure of a wafer is generally 20% of manpower cost, 40% of flow, 35% of packaging, and 5% of testing [for advanced processes.

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Rigid-Flex PCB Advantages and Disadvantages

2023-01-14

If you compare "Flexible and Rigid board" with "FPC flexible board + PCB circuit board + connector", the biggest disadvantage is that the price of "Flexible and Rigid board" is more expensive.

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OSP Process Advantages and Disadvantages

2022-11-06

Advantages and Disadvantages of OSP Process,Simply put, OSP is the chemical growth of an organic film on a clean bare copper surface. Because it is organic and not metal, it is cheaper than tin spraying.

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